? semiconductor components industries, llc, 2012 january, 2012 ? rev. 5 1 publication order number: mbra210lt3/d mbra210lt3g, NRVBA210LT3G surface mount schottky power rectifier sma power surface mount package this device employs the schottky barrier principle in a metal ? to ? silicon power rectifier. features epitaxial construction with oxide passivation and metal overlay contact. ideally suited for low voltage, high frequency switching power supplies; free wheeling diodes and polarity protection diodes. typical applications are ac ? dc and dc ? dc converters, reverse battery protection, and ?oring? of multiple supply voltages and any other application where performance and size are critical. features ? ultra low v f ? 1st in the market place with a 10 v r schottky rectifier ? compact package with j ? bend leads ideal for automated handling ? highly stable oxide passivated junction ? guardring for over ? voltage protection ? optimized for low forward voltage ? aec ? q101 qualified and ppap capable ? nrvba prefix for automotive and other applications requiring unique site and control change requirements ? all packages are pb ? free* mechanical characteristics: ? case: molded epoxy ? epoxy meets ul 94 v ? 0 @ 0.125 in ? weight: 70 mg (approximately) ? finish: all external surfaces corrosion resistant and terminal leads are readily solderable ? lead and mounting surface temperature for soldering purposes: 260 ? c max. for 10 seconds ? polarity: polarity band indicates cathode lead ? esd ratings: ? machine model = c ? human body model = 3a *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. schottky barrier rectifier 2 amperes 10 volts http://onsemi.com device package shipping ? ordering information mbra210lt3g sma (pb ? free) 5,000/tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. marking diagram sma case 403d plastic b2l1 ayww b2l1 = specific device code a = assembly location y = year ww = work week = pb ? free package NRVBA210LT3G sma (pb ? free) 5,000/tape & reel
mbra210lt3g, NRVBA210LT3G http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 10 v average rectified forward current (at rated v r , t l = 110 ? c) i o 2.0 a non ? repetitive peak surge current (surge applied at rated load conditions halfwave, single phase, 60 hz) i fsm 160 a storage/operating case temperature operating junction temperature t stg , t c t j ? 55 to +125 ? c voltage rate of change (rated v r , t j = 25 ? c) dv/dt 10,000 v/ s stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. thermal characteristics characteristic symbol min pad 1 inch pad unit thermal resistance, junction ? to ? lead thermal resistance, junction ? to ? ambient r jl r ja 22 150 15 81 ? c/w electrical characteristics maximum instantaneous forward voltage (note 1) v f t j = 25 ? c t j = 100 ? c v (i f = 0.1 a) (i f = 1.0 a) (i f = 2.0 a) 0.260 0.325 0.350 0.15 0.23 0.26 maximum instantaneous reverse current i r t j = 25 ? c t j = 100 ? c ma (v r = 5.0 v) (v r = 10 v) 0.25 0.70 40 60 1. pulse test: pulse width ? 250 s, duty cycle ? 2%. figure 1. typical forward voltage 0.1 0.2 0.4 0.15 0.45 100 0.1 1 i f , instantaneous forward current (amps) v f , instantaneous forward voltage (volts) figure 2. maximum forward voltage 0.15 0.35 0.45 0.25 0.55 100 0.1 1 v f , maximum instantaneous forward voltage (volts) i f , maximum instantaneous forward current (amps) v f @ 125 ? c 100 ? c 75 ? c v f @ 125 ? c 0.05 0.05 0.3 0.25 0.35 25 ? c 10 10 25 ? c 100 ? c 75 ? c
mbra210lt3g, NRVBA210LT3G http://onsemi.com 3 figure 3. typical reverse current 2610 04 8 i r , reverse current (amps) v r , reverse voltage (volts) 1.0e ? 01 i r @ 125 ? c 100 ? c 75 ? c 25 ? c 1.0e ? 02 1.0e ? 03 1.0e ? 04 1.0e ? 05 figure 4. current derating ? junction to lead 90 100 110 130 95 120 0 3.5 i f , average forward current (amps) t l , lead temperature ( ? c) figure 5. forward power dissipation 1 2.5 3 0 2 3.5 0.9 0 0.5 i f(av) , average forward current (amps) p fo , average power dissipation (watts) figure 6. typical capacitance 2610 04 8 10,000 100 c, capacitance (pf) v r , reverse voltage (volts) 1000 1 2 3 2.5 square wave dc rated voltage applied r jl = 22 ? c/w t j = 125 ? c 0.2 0.4 0.6 t j = 125 ? c square wave dc 105 115 125 0.5 1.5 0.5 1.5 0.1 0.3 0.7 0.8 159 37 25 ? c f = 1 mhz
mbra210lt3g, NRVBA210LT3G http://onsemi.com 4 figure 7. thermal response, junction to ambient (min pad) t, time (s) 0.0001 0.001 0.1 0.00001 0.01 1 10 100 1000 r (t) , transient thermal resistance ( ? c/w) 0.1 1 10 100 d = 0.5 0.2 0.1 single pulse 0.05 0.02 0.01 figure 8. thermal response, junction to ambient (1 inch pad) t, time (s) 0.0001 0.001 0.1 0.00001 0.01 1 10 100 1000 r (t) , transient thermal resistance ( ? c/w) 0.1 1 10 100 d = 0.5 0.2 0.1 single pulse 0.05 0.02 0.01
mbra210lt3g, NRVBA210LT3G http://onsemi.com 5 package dimensions dim a min nom max min millimeters 1.97 2.10 2.20 0.078 inches a1 0.05 0.10 0.15 0.002 b 1.27 1.45 1.63 0.050 c 0.15 0.28 0.41 0.006 d 2.29 2.60 2.92 0.090 e 4.06 4.32 4.57 0.160 l 0.76 1.14 1.52 0.030 0.083 0.087 0.004 0.006 0.057 0.064 0.011 0.016 0.103 0.115 0.170 0.180 0.045 0.060 nom max 4.83 5.21 5.59 0.190 0.205 0.220 h e sma case 403d ? 02 issue f style 1: pin 1. cathode (polarity band) 2. anode e bd l c a a1 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 403d ? 01 obsolete, new standard is 403d ? 02. polarity indicator optional as needed (see styles) 4.0 0.157 2.0 0.0787 2.0 0.0787 mm inches scale 8:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* h e on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mbra210lt3/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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